Thick film metallized substrate/package (printing specifications)
This is a substrate printed with thick film circuits using alumina and aluminum nitride substrates that excel in thermal conductivity, and it has been sintered at high temperatures.
This is a substrate made by printing thick-film circuits using alumina and aluminum nitride substrates with excellent thermal conductivity, and then firing it at high temperatures. The surface allows for the formation of electrodes, enabling the realization of compact and multifunctional substrates. Additionally, the via structure allows for conductivity between the front and back sides.
- Company：MARUWA 本社,東京支店,関西支店,東北営業所,北信越営業所,九州北営業所,R&Dセンター
- Price：Other
